Materials for Advanced Packaging

Lu, Daniel; Wong, C.P.

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Details

Published by: Springer

Publication Date: 2008-12-10

Format: Hardcover

ISBN-13: 9780387782188

DOI: 10.1007/978-0-387-78219-5

Dimensions: 235cm x155cm

Pages: 724