{"product_id":"9780387887821","title":"Electrical Conductive Adhesives with Nanotechnologies","description":"\u003ch1\u003eElectrical Conductive Adhesives with Nanotechnologies\u003c\/h1\u003e \u003ch2\u003eLi, Yi (Grace); Lu, Daniel; Wong, C.P.\u003c\/h2\u003e \u003cp\u003e\u003c\/p\u003e\u003cp\u003e“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives\/Films (ACA\/ACF) and Nonconductive Adhesives\/Films (NCA\/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives\/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2009-10-16\u003c\/p\u003e \u003cp\u003eFormat: Hardcover\u003c\/p\u003e \u003cp\u003eISBN-13: 9780387887821\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-0-387-88783-8\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 437\u003c\/p\u003e ","brand":"Springer US","offers":[{"title":"Default Title","offer_id":50148680663180,"sku":"9780387887821","price":179.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9780387887821.jpg?v=1779567046","url":"https:\/\/lateknightbooks.com\/products\/9780387887821","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}