{"product_id":"9781118881477","title":"From LED to Solid State Lighting Principles, Materials, Packaging, Characterization, and Applications","description":"\u003ch1\u003eFrom LED to Solid State Lighting\u003c\/h1\u003e\u003ch2\u003ePrinciples, Materials, Packaging, Characterization, and Applications\u003c\/h2\u003e\u003ch3\u003eS. W. Ricky Lee | Jeffery C. C. Lo | Mian Tao | Huaiyu Ye\u003c\/h3\u003e\u003cdiv\u003e\u003cb\u003eTechnology \u0026amp; Engineering \/ Electronics \/ Circuits \/ General\u003c\/b\u003e\u003c\/div\u003e\u003cbr\u003e\u003cdiv\u003e\n\u003cb\u003eFROM LED TO SOLID STATE LIGHTING\u003c\/b\u003e \u003cp\u003e\u003cb\u003eA comprehensive and practical reference complete with hands-on exercises and experimental data\u003c\/b\u003e \u003c\/p\u003e\n\u003cp\u003eIn \u003ci\u003eFrom LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications\u003c\/i\u003e, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. \u003c\/p\u003e\n\u003cp\u003eReaders will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. \u003c\/p\u003e\n\u003cp\u003eThis important book also includes: \u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eThorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips\u003c\/li\u003e \u003cli\u003ePractical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization\u003c\/li\u003e \u003cli\u003eComprehensive explorations of board-level assembly and LED modules and optical and electrical characterization\u003c\/li\u003e \u003cli\u003eIn-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting\u003c\/li\u003e\n\u003c\/ul\u003e \u003cp\u003ePerfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, \u003ci\u003eFrom LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications\u003c\/i\u003e is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.\u003c\/p\u003e\n\u003c\/div\u003e\u003cdiv\u003e \u003cp\u003e\u003cb\u003eShi-Wei Ricky Lee, PhD,\u003c\/b\u003e received his PhD degree in Aeronautical \u0026amp; Astronautical Engineering from Purdue University in 1992. Currently he is Chair Professor of Mechanical and Aerospace Engineering and Director of Foshan Research Institute for Smart Manufacturing at the Hong Kong University of Science and Technology (HKUST).\u003c\/p\u003e \u003cp\u003e\u003cb\u003eJeffery C. C. Lo, PhD,\u003c\/b\u003e received his Bachelor (1st Class Honour) and MPhil degrees in Mechanical Engineering from the Hong Kong University of Science and Technology (HKUST) in 2002 and 2004 respectively. He is currently the Program Manager at the Center for Advanced Microsystems Packaging at HKUST and Assistant Director of FRISM. \u003c\/p\u003e\n\u003cp\u003e\u003cb\u003eMian Tao, PhD,\u003c\/b\u003e received his MSc degree from the Hong Kong University of Science and Technology (HKUST) in Mechanical Engineering in 2010 and PhD degree in 2016. His research interests include thermal characterization and management of high power electronics and development of advanced microelectronic packages. \u003c\/p\u003e\n\u003cp\u003e\u003cb\u003eHuaiyu Ye, PhD,\u003c\/b\u003e received his PhD degree from the Department of Microelectronics, Delft University of Technology in 2014. Currently he is Associate Professor of Southern University of Science and Technology (SUSTech). \u003c\/p\u003e\n\u003c\/div\u003e\u003cbr\u003e\u003ctable\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublication Date: \u003c\/td\u003e\n\u003ctd\u003e28 September 2021\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublisher: \u003c\/td\u003e\n\u003ctd\u003eWiley\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eImprint: \u003c\/td\u003e\n\u003ctd\u003eWiley\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eISBN-13: \u003c\/td\u003e\n\u003ctd\u003e9781118881477\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFormat: \u003c\/td\u003e\n\u003ctd\u003eHardback\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePage Count: \u003c\/td\u003e\n\u003ctd\u003e256\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight (oz): \u003c\/td\u003e\n\u003ctd\u003e21.52\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/table\u003e","brand":"Wiley","offers":[{"title":"Default Title","offer_id":44312945754252,"sku":"9781118881477","price":121.46,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9781118881477.jpg?v=1780164799","url":"https:\/\/lateknightbooks.com\/products\/9781118881477","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}