{"product_id":"9781119314134","title":"Advances in Embedded and Fan-Out Wafer Level Packaging Technologies","description":"\u003ch3\u003eIEEE Press\u003c\/h3\u003e\u003ch1\u003eAdvances in Embedded and Fan-Out Wafer Level Packaging Technologies\u003c\/h1\u003e\u003ch3\u003eBeth Keser | Steffen Kr¿hnert\u003c\/h3\u003e\u003cdiv\u003e\u003cb\u003eTechnology \u0026amp; Engineering \/ Electronics \/ Circuits \/ General\u003c\/b\u003e\u003c\/div\u003e\u003cbr\u003e\u003cdiv\u003e\n\u003cp\u003e\u003cb\u003eExamines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eEmbedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons.\u003c\/p\u003e \u003cp\u003eFilled with contributions from some of the field's leading experts,\u003ci\u003eAdvances in Embedded and Fan-Out Wafer Level Packaging Technologies\u003c\/i\u003e begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions.\u003c\/p\u003e \u003cul\u003e \u003cli\u003eDiscusses specific company standards and their development results\u003c\/li\u003e \u003cli\u003eContent relates to practice as well as to contemporary and future challenges in electronics system integration and packaging\u003c\/li\u003e \u003c\/ul\u003e \u003cp\u003e\u003ci\u003eAdvances in Embedded and Fan-Out Wafer Level Packaging Technologies\u003c\/i\u003e will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.\u003c\/p\u003e\n\u003c\/div\u003e\u003cdiv\u003e  \u003cp\u003e\u003cb\u003eBeth Keser, Ph.D.,\u003c\/b\u003e is a recognized global leader in the semiconductor industry with over 20 years' experience resulting in 28 patents and patents pending and over 40 publications. She is an IEEE Senior Member whose volunteer activities and professional society responsibilities include: IEEE EPS' VP of Education, 2015 ECTC General Chair, and more. \u003c\/p\u003e\n\u003cp\u003e\u003cb\u003eSteffen Kröhnert, M.S\u003csmall\u003eC\u003c\/small\u003e.,\u003c\/b\u003e is Senior Director of Technology Development at Amkor Technology Holding B.V., Germany. He has more than 20 years' experience in the semiconductor industry. Steffen is author and co-author of 23 patent filings in the area of Semiconductor Packaging Technology, and an active member of IEEE EPS, IMAPS, SMTA, VDI, VDE and GPM.\t \u003c\/p\u003e\n\u003c\/div\u003e\u003cbr\u003e\u003ctable\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublication Date: \u003c\/td\u003e\n\u003ctd\u003e12 February 2019\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublisher: \u003c\/td\u003e\n\u003ctd\u003eWiley\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eImprint: \u003c\/td\u003e\n\u003ctd\u003eWiley-IEEE Press\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eISBN-13: \u003c\/td\u003e\n\u003ctd\u003e9781119314134\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFormat: \u003c\/td\u003e\n\u003ctd\u003eHardback\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePage Count: \u003c\/td\u003e\n\u003ctd\u003e576\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight (oz): \u003c\/td\u003e\n\u003ctd\u003e36.0\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/table\u003e","brand":"Wiley","offers":[{"title":"Default Title","offer_id":44310513582220,"sku":"9781119314134","price":139.45,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9781119314134_da778ff1-05fd-453e-a1ab-0bf35fc59bf2.jpg?v=1780107537","url":"https:\/\/lateknightbooks.com\/products\/9781119314134","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}