{"product_id":"9781119556633","title":"Antenna-in-Package Technology and Applications","description":"\u003ch3\u003eIEEE Press\u003c\/h3\u003e\u003ch1\u003eAntenna-in-Package Technology and Applications\u003c\/h1\u003e\u003ch3\u003eDuixian Liu | Yueping Zhang\u003c\/h3\u003e\u003cdiv\u003e\u003cb\u003eTechnology \u0026amp; Engineering \/ Mobile \u0026amp; Wireless Communications\u003c\/b\u003e\u003c\/div\u003e\u003cbr\u003e\u003cdiv\u003e\n\u003cp\u003e\u003cb\u003eA comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003e\u003ci\u003eAntenna-in-Package Technology and Applications\u003c\/i\u003e contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. \u003cbr\u003e \u003cbr\u003e The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book:\u003c\/p\u003e \u003cp\u003e• Includes a brief history of antenna-in-package technology \u003cbr\u003e • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) \u003cbr\u003e • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance\u003c\/p\u003e \u003cp\u003eWritten for students in electrical engineering, professors, researchers, and RF engineers, \u003ci\u003eAntenna-in-Package Technology and Applications\u003c\/i\u003e offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.\u003c\/p\u003e\n\u003c\/div\u003e\u003cdiv\u003e \u003cp\u003e\u003cb\u003eDUIXIAN LIU, PHD,\u003c\/b\u003e is a researcher and master inventor at IBM at Thomas J. Watson Research Center. He is a co-editor of the Wiley title\u003ci\u003e Advanced Millimeter-wave Technologies: Antennas, Packaging and Circuits\u003c\/i\u003e and Springer title\u003ci\u003e Handbook of Antenna Technologies.\u003c\/i\u003e He served as an Associate Editor of the IEEE \u003ci\u003eTransactions on Antennas and Propagation\u003c\/i\u003e for nine years and a Guest Editor for the IEEE \u003ci\u003eTransactions on Antennas and Propagation on\u003c\/i\u003efour Special \u003ci\u003eIssues\u003c\/i\u003e related to mm-wave antenna designs. He received the prestigious IEEE AP-S Sergei A. Schelkunoff Prize Paper Award in 2012. He is a Fellow of IEEE.\u003c\/p\u003e \u003cp\u003e\u003cb\u003eYUEPING ZHANG, PhD,\u003c\/b\u003e is a Professor of Electronic Engineering at Nanyang Technological University and a Distinguished Lecturer of the IEEE Antennas and Propagation Society (IEEE AP-S). He served as an Associate Editor of the \u003ci\u003eIEEE Transactions on Antennas and Propagation.\u003c\/i\u003e He received the prestigious IEEE AP-S Sergei A. Schelkunoff Prize Paper Award in 2012. He is a Fellow of IEEE.\u003c\/p\u003e\n\u003c\/div\u003e\u003cbr\u003e\u003ctable\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublication Date: \u003c\/td\u003e\n\u003ctd\u003e31 March 2020\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePublisher: \u003c\/td\u003e\n\u003ctd\u003eWiley\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eImprint: \u003c\/td\u003e\n\u003ctd\u003eWiley-IEEE Press\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eISBN-13: \u003c\/td\u003e\n\u003ctd\u003e9781119556633\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFormat: \u003c\/td\u003e\n\u003ctd\u003eHardback\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePage Count: \u003c\/td\u003e\n\u003ctd\u003e416\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eWeight (oz): \u003c\/td\u003e\n\u003ctd\u003e26.4\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/table\u003e","brand":"Wiley","offers":[{"title":"Default Title","offer_id":44377773637772,"sku":"9781119556633","price":130.45,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9781119556633_50358278-51e9-42d9-81df-aee9e53b6b51.jpg?v=1780281963","url":"https:\/\/lateknightbooks.com\/products\/9781119556633","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}