Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
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Fundamentals of Lead-Free Solder Interconnect Technology
From Microstructures to Reliability
Tae-Kyu Lee | Thomas R. Bieler | Choong-Un Kim | Hongtao Ma
Technology & Engineering / Electronics / General
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
| Publication Date: | 06 November 2014 |
| Publisher: | Springer US |
| Imprint: | Springer |
| ISBN-13: | 9781461492658 |
| Format: | Hardback |
| Page Count: | 253 |