Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

Lee, Tae-Kyu; Bieler, Thomas R.; Kim, Choong-Un; Ma, Hongtao

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

Details

Published by: Springer

Publication Date: 2016-10-01

Format: Paperback

ISBN-13: 9781489978011

DOI: 10.1007/978-1-4614-9266-5

Dimensions: 235cm x155cm

Pages: 253