Electrical Conductive Adhesives with Nanotechnologies

Li, Yi (Grace); Lu, Daniel; Wong, C.P.

“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

Details

Published by: Springer

Publication Date: 2014-09-05

Format: Paperback

ISBN-13: 9781489983077

DOI: 10.1007/978-0-387-88783-8

Dimensions: 235cm x155cm

Pages: 437