RF and Microwave Microelectronics Packaging

Kuang, Ken; Kim, Franklin; Cahill, Sean S.

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Details

Published by: Springer

Publication Date: 2014-09-05

Format: Paperback

ISBN-13: 9781489983244

DOI: 10.1007/978-1-4419-0984-8

Dimensions: 235cm x155cm

Pages: 285