{"product_id":"9781489983244","title":"RF and Microwave Microelectronics Packaging","description":"\u003ch1\u003eRF and Microwave Microelectronics Packaging\u003c\/h1\u003e \u003ch2\u003eKuang, Ken; Kim, Franklin; Cahill, Sean S.\u003c\/h2\u003e \u003cp\u003e\u003c\/p\u003e\u003cp\u003eRF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical\/RF\/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF\/MW packaging-related fields.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2014-09-05\u003c\/p\u003e \u003cp\u003eFormat: Paperback\u003c\/p\u003e \u003cp\u003eISBN-13: 9781489983244\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-1-4419-0984-8\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 285\u003c\/p\u003e ","brand":"Springer US","offers":[{"title":"Default Title","offer_id":50149863948428,"sku":"9781489983244","price":152.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9781489983244.jpg?v=1779580745","url":"https:\/\/lateknightbooks.com\/products\/9781489983244","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}