Design for Manufacturability: From 1D to 4D for 90–22 nm Technology Nodes

Balasinski, Artur

This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes.  It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.

Details

Published by: Springer

Publication Date: 2016-08-23

Format: Paperback

ISBN-13: 9781493943425

DOI: 10.1007/978-1-4614-1761-3

Dimensions: 235cm x155cm

Pages: 278