Engineering Materials and Processes: Devices, Interconnects and Packaging
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$197.10
Regular price $219.00
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Engineering Materials and Processes: Devices, Interconnects and Packaging
Sale price
$197.10
Regular price $219.00
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Engineering Materials and Processes: Devices, Interconnects and Packaging
Zschech, Ehrenfried; Whelan, Caroline; Mikolajick, Thomas
Details
Published by: Springer
Publication Date: 2010-10-22
Format: Paperback
ISBN-13: 9781849969673
DOI: 10.1007/1-84628-235-7
Dimensions: 235cm x155cm
Pages: 508