Engineering Materials and Processes: Devices, Interconnects and Packaging

Zschech, Ehrenfried; Whelan, Caroline; Mikolajick, Thomas

Details

Published by: Springer

Publication Date: 2005-09-01

Format: Hardcover

ISBN-13: 9781852339418

DOI: 10.1007/1-84628-235-7

Dimensions: 235cm x155cm

Pages: 508