{"product_id":"9781852339418","title":"Engineering Materials and Processes: Devices, Interconnects and Packaging","description":"\u003ch1\u003eEngineering Materials and Processes: Devices, Interconnects and Packaging\u003c\/h1\u003e \u003ch2\u003eZschech, Ehrenfried; Whelan, Caroline; Mikolajick, Thomas\u003c\/h2\u003e \u003cp\u003e\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2005-09-01\u003c\/p\u003e \u003cp\u003eFormat: Hardcover\u003c\/p\u003e \u003cp\u003eISBN-13: 9781852339418\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/1-84628-235-7\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 508\u003c\/p\u003e ","brand":"Springer London","offers":[{"title":"Default Title","offer_id":46265556041868,"sku":"9781852339418","price":197.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9781852339418.jpg?v=1770783454","url":"https:\/\/lateknightbooks.com\/products\/9781852339418","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}