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This book focuses on the mechanical properties of silicides for very large scale integration (VLSI) applications. It presents the fabrication process for bulk silicides and thin films, and list complete testing deformation for a variety of silicon based compounds. The author also presents dislocation in silicides, fatigue and fracture aspects. A special chapter is given on deformation in silicides in the nano scale. Composites and alloys are also considered.
Published by: Springer
Publication Date: 2019-07-30
Format: Hardcover
ISBN-13: 9783030225971
DOI: 10.1007/978-3-030-22598-8
Dimensions: 235cm x155cm
Pages: 274