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This book captures the author’s 35+ years of learning & experience in the semiconductor chip industry to provide a proven roadmap for successful, new product introduction process, tailored specifically to the semiconductor industry. The content includes a simplified process flow, success metrics, execution guidelines, checklists & calculators. The presentation is based on a product engineering centric “NPI hub” and the author guides readers through the complete process of semiconductor new product introduction, ensuring a successful plan execution.
Published by: Springer
Publication Date: 2022-12-06
Format: Hardcover
ISBN-13: 9783031180293
DOI: 10.1007/978-3-031-18030-9
Dimensions: 240cm x168cm
Pages: 90