Synthesis Lectures on Engineering, Science, and Technology

Asadizanjani, Navid; Reddy Kottur , Himanandhan; Dalir, Hamed

This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.

Details

Published by: Springer

Publication Date: 2025-04-23

Format: Hardcover

ISBN-13: 9783031861017

DOI: 10.1007/978-3-031-86102-4

Dimensions: 240cm x168cm

Pages: 183