{"product_id":"9783031861017","title":"Synthesis Lectures on Engineering, Science, and Technology","description":"\u003ch1\u003eSynthesis Lectures on Engineering, Science, and Technology\u003c\/h1\u003e \u003ch2\u003eAsadizanjani, Navid; Reddy Kottur , Himanandhan; Dalir, Hamed\u003c\/h2\u003e \u003cp\u003e\u003c\/p\u003e\u003cp\u003eThis book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2025-04-23\u003c\/p\u003e \u003cp\u003eFormat: Hardcover\u003c\/p\u003e \u003cp\u003eISBN-13: 9783031861017\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-3-031-86102-4\u003c\/p\u003e \u003cp\u003eDimensions: 240cm x168cm\u003c\/p\u003e \u003cp\u003ePages: 183\u003c\/p\u003e ","brand":"Springer Nature Switzerland","offers":[{"title":"Default Title","offer_id":45385620947084,"sku":"9783031861017","price":49.49,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9783031861017.jpg?v=1776055568","url":"https:\/\/lateknightbooks.com\/products\/9783031861017","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}