{"product_id":"9783031947940","title":"Springer Series in Reliability Engineering","description":"\u003ch1\u003eSpringer Series in Reliability Engineering\u003c\/h1\u003e \u003ch2\u003eGan, Chong Leong; Huang, Chen Yu\u003c\/h2\u003e \u003cp\u003e\u003c\/p\u003e\u003cp\u003eThis book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).\u003c\/p\u003e\n\u003cp\u003eThe book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2025-07-22\u003c\/p\u003e \u003cp\u003eFormat: Hardcover\u003c\/p\u003e \u003cp\u003eISBN-13: 9783031947940\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-3-031-94795-7\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 178\u003c\/p\u003e ","brand":"Springer Nature Switzerland","offers":[{"title":"Default Title","offer_id":44309221048460,"sku":"9783031947940","price":161.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9783031947940.jpg?v=1775742448","url":"https:\/\/lateknightbooks.com\/products\/9783031947940","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}