{"product_id":"9783319023809","title":"SpringerBriefs in Electrical and Computer Engineering","description":"\u003ch1\u003eSpringerBriefs in Electrical and Computer Engineering\u003c\/h1\u003e \u003ch2\u003eKim, Chulwoo; Lee, Hyun-Woo; Song, Junyoung\u003c\/h2\u003e \u003cp\u003eThis book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I\/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2013-11-18\u003c\/p\u003e \u003cp\u003eFormat: Paperback\u003c\/p\u003e \u003cp\u003eISBN-13: 9783319023809\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-3-319-02381-6\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 88\u003c\/p\u003e ","brand":"Springer International Publishing","offers":[{"title":"Default Title","offer_id":47400356184204,"sku":"9783319023809","price":71.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9783319023809.jpg?v=1775783819","url":"https:\/\/lateknightbooks.com\/products\/9783319023809","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}