3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

Elfadel, Ibrahim (Abe) M.; Fettweis, Gerhard

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

Details

Published by: Springer

Publication Date: 2016-05-23

Format: Hardcover

ISBN-13: 9783319204802

DOI: 10.1007/978-3-319-20481-9

Dimensions: 235.0cm x155.0cm

Pages: 339.0