Carbon Nanotubes for Interconnects: Process, Design and Applications

Todri-Sanial, Aida; Dijon, Jean; Maffucci, Antonio

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Details

Published by: Springer

Publication Date: 2018-05-30

Format: Paperback

ISBN-13: 9783319806426

DOI: 10.1007/978-3-319-29746-0

Dimensions: 235cm x155cm

Pages: 333