Electrical Design of Through Silicon Via

Lee, Manho; Pak, Jun So; Kim, Joungho

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

Details

Published by: Springer

Publication Date: 2016-09-27

Format: Paperback

ISBN-13: 9789401779494

DOI: 10.1007/978-94-017-9038-3

Dimensions: 235cm x155cm

Pages: 280