{"product_id":"9789401779494","title":"Electrical Design of Through Silicon Via","description":"\u003ch1\u003eElectrical Design of Through Silicon Via\u003c\/h1\u003e \u003ch2\u003eLee, Manho; Pak, Jun So; Kim, Joungho\u003c\/h2\u003e \u003cp\u003e\u003c\/p\u003e\u003cp\u003eThrough Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2016-09-27\u003c\/p\u003e \u003cp\u003eFormat: Paperback\u003c\/p\u003e \u003cp\u003eISBN-13: 9789401779494\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-94-017-9038-3\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 280\u003c\/p\u003e ","brand":"Springer Netherlands","offers":[{"title":"Default Title","offer_id":46266561200268,"sku":"9789401779494","price":98.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9789401779494.jpg?v=1770825069","url":"https:\/\/lateknightbooks.com\/products\/9789401779494","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}