Assembly and Reliability of Lead-Free Solder Joints

Lau, John H.; Lee, Ning-Cheng

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

Details

Published by: Springer

Publication Date: 2020-05-30

Format: Hardcover

ISBN-13: 9789811539190

DOI: 10.1007/978-981-15-3920-6

Dimensions: 235cm x155cm

Pages: 527