Reliability Technology for Integrated Circuit Packaging

Zhou, Bin; En, Yunfei; Chen, Si

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.

Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.

Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

Details

Published by: Springer

Publication Date: 2026-04-21

Format: Hardcover

ISBN-13: 9789819538843

DOI: 10.1007/978-981-95-3885-0

Dimensions: 235cm x155cm

Pages: 510