{"product_id":"9789819721399","title":"Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology","description":"\u003ch1\u003eFlip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology\u003c\/h1\u003e \u003ch2\u003eLau, John H.\u003c\/h2\u003e \u003cp\u003e\u003c\/p\u003e\u003cp\u003eThis book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics.\u003c\/p\u003e\u003cp\u003eThe book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.\u003c\/p\u003e \u003ch3\u003eDetails\u003c\/h3\u003e \u003cp\u003ePublished by: Springer\u003c\/p\u003e \u003cp\u003ePublication Date: 2024-05-24\u003c\/p\u003e \u003cp\u003eFormat: Hardcover\u003c\/p\u003e \u003cp\u003eISBN-13: 9789819721399\u003c\/p\u003e \u003cp\u003eDOI: 10.1007\/978-981-97-2140-5\u003c\/p\u003e \u003cp\u003eDimensions: 235cm x155cm\u003c\/p\u003e \u003cp\u003ePages: 501\u003c\/p\u003e ","brand":"Springer Nature Singapore","offers":[{"title":"Default Title","offer_id":45169222287500,"sku":"9789819721399","price":179.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0710\/9545\/1788\/files\/9789819721399.jpg?v=1772946733","url":"https:\/\/lateknightbooks.com\/products\/9789819721399","provider":"Late Knight Books and Services, LLC","version":"1.0","type":"link"}