• This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.
• Describes the processes available for creating integrated passives, measuring their properties, and applying them.
• Brings reader up to date in a fast-moving technology.
• Enables reader to implement the technology into a manufacturing environment.
• Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.
• Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.

LEONARD W. SCHAPER, Jr., Dr Engr Sc, is a professor of Electrical Engineering at the University of Arkansas in Fayetteville. He is a Fellow of both the IEEE and the International Microelectronics and Packaging Society. He chairs the IEEE CPMT Technical Committee on Discrete and Integral Passives.