3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

Hwang, Lih-Tyng; Horng, Tzyy-Sheng Jason

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

• Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
• Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab
• Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
• Provides chapter-wise review questions and powerpoint slides as teaching tools

Details

Published by: Wiley-IEEE Press

Publication Date: 2018-07-18

Format: Hardcover

ISBN-13: 9781119289647

DOI:

Dimensions: 238.8cm x167.6cm

Pages: 464.0