Testing of Interposer-Based 2.5D Integrated Circuits

Name: Testing of Interposer-Based 2.5D Integrated Circuits
Brand: Springer International Publishing
SKU: 9783319854618
Price: 107.99 USD
Availability: InStock

Wang, Ran; Chakrabarty, Krishnendu

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.