Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium: EPITS 2022, 14-15 September, Langkawi, Malaysia

Mohd Salleh, Mohd Arif Anuar; Che Halin, Dewi Suriyani; Abdul Razak, Kamrosni; Ramli, Mohd Izrul Izwan

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14^th  and 15^th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.

Details

Published by: Springer

Publication Date: 2024-07-04

Format: Paperback

ISBN-13: 9789811992698

DOI: 10.1007/978-981-19-9267-4

Dimensions: 235.0cm x155.0cm

Pages: 875.0